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What you need to know
A recent leak of a datasheet has shed light on the specifications of the anticipated Snapdragon 8 Gen 4 System on a Chip (SoC). This flagship chipset is expected to come in two variations, identified by the model numbers SM8750 and SM8750P, with the latter tailored for enhanced performance.
Qualcomm appears to be preparing for its next-generation flagship SoC, with expectations set for an announcement during the forthcoming Snapdragon Summit. This summit, scheduled for October, is highly anticipated as it is likely to showcase the Snapdragon 8 Gen 4, which will feature the newly developed Oryon CPU.
Following earlier benchmark leaks, the latest datasheet, shared by SmartPrix, reveals crucial details regarding the new chipset. Notably, the presence of two model numbers indicates that Qualcomm is likely poised to release both a standard and a higher-performance version of the SoC.
The suffix “P” in the model number is indicative of enhanced performance capabilities, allowing the SM8750P variant to deliver slightly superior results compared to its counterpart. This flagship chipset is slated to drive many high-end Android devices, commencing in the last quarter of 2024.
The Snapdragon 8 Gen 4 is set to be fabricated using a cutting-edge 3nm process technology, aimed at achieving remarkable levels of performance and energy efficiency. This upgrade may be largely attributed to the new Oryon CPU, which Qualcomm’s chief marketing officer, Don McGuire, confirmed earlier this year at Mobile World Congress.
The forthcoming chipset will include the Adreno 8-series GPU, expected to deliver outstanding graphics performance while maintaining power efficiency. Additionally, a new image signal processor (ISP) from the 8-series will enhance both photography and videography experiences. As a 5G-enabled SoC, the datasheet also highlights compatibility with mmWave and Sub-6 band technologies.
Other notable features of the Snapdragon 8 Gen 4 encompass a Low-Power AI (LPAI) subsystem integrated with a dedicated digital signal processor (DSP) and an AI accelerator (eNPU), as well as Qualcomm’s Sensing Hub (QSH) to boost AI capabilities. The chipset is also set to support the FastConnect 7900 modem, enabling Wi-Fi 7 and Bluetooth 5.4 connectivity, alongside LPDDR5X RAM and Ultra-Wideband (UWB) functionality.
With these promising specifications, the Snapdragon 8 Gen 4 is eagerly awaited by both industry experts and consumers. The Snapdragon Summit, scheduled for October 21-24 in Hawaii, will provide an important platform for Qualcomm to unveil its advancements in semiconductor technology. Following the official launch, Xiaomi is expected to be one of the first manufacturers to integrate this high-performance chipset into its Android smartphones by the year’s end.
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