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Samsung Engages with YMTC Over Hybrid Bonding TechnologyThe Collaboration Aims to Mitigate Patent Infringement Risks in 400-Layer NAND ProductionUS-China Trade Relations May Play a Role in the Agreement
Samsung Electronics has formalized a partnership with Yangtze Memory Technologies Co. (YMTC), granting the South Korean tech giant access to the Chinese company’s advanced bonding technology for its upcoming 400-layer NAND flash memory production.
YMTC, established in 2016 in Wuhan, is a key subsidiary of Tsinghua Unigroup, receiving substantial support from the Chinese government. The company specializes in 3D NAND flash memory, which is essential for a range of storage solutions, including solid-state drives (SSDs), mobile phones, and data center applications. Notably, it has introduced Xtacking technology, a unique architecture designed to enhance performance and density in NAND flash products.
Reports from Korea’s ChosunBiz suggest that Samsung’s decision to forge this agreement was partly motivated by the desire to circumvent potential patent litigations concerning the hybrid bonding method, which is set to be crucial for mass-producing 400-layer NAND chips.
Are US-China Trade Tensions a Consideration?
According to industry insights, YMTC is a pioneer in hybrid bonding technology for NAND flash memory and has secured the relevant patents. While it remains behind leading semiconductor manufacturers like Samsung and SK Hynix in terms of market share, it is rapidly advancing, recently achieving mass production of 294-layer NAND flash memory, according to the same report.
The collaborative agreement is expected to shield both Samsung and YMTC from inadvertent patent infringements. Last year, YMTC took legal action against Micron in a U.S. court, claiming violations related to its NAND technologies.
An industry expert quoted by ChosunBiz stated, “In the memory semiconductor sector, it is customary for companies to establish licensing agreements early to avert disputes over patents as they develop and manufacture next-generation products. Such agreements are standard in the industry; however, there is rising concern over the diminishing technological divide between Chinese companies and leading global players, given that Samsung, a frontrunner in the NAND flash market, is now leveraging patents owned by a Chinese entity.”
Moreover, eeNews Analog speculates that the ramifications of the ongoing US-China trade conflict might compel YMTC to reconsider its market strategies outside China. It raises the possibility that structuring licensing or cross-licensing agreements could enhance YMTC’s commercial prospects.
While ChosunBiz does not delve into SK Hynix’s position in this context, it stands to reason that the South Korean competitor could be pursuing or have already initiated similar licensing arrangements with YMTC to ensure access to this significant hybrid bonding technology for its own NAND flash manufacturing processes.
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