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The ongoing trend of miniaturizing electronic chips, as characterized by Moore’s law, has been instrumental in shaping our current digital landscape. Nonetheless, the performance capabilities of compact electronic devices remain hampered by insufficient advanced cooling solutions.
A recent study published in Cell Reports Physical Science, conducted by researchers from the Institute of Industrial Science at The University of Tokyo, presents a promising advancement in the cooling efficiency of electronic chips.
Contemporary cooling techniques are increasingly favoring the incorporation of microchannels directly within the chip architecture. These microchannels facilitate the circulation of water, which effectively absorbs and removes heat from the chip’s surface.
Despite the potential of this technique, its effectiveness is limited by the sensible heat of water, defined as the quantity of heat required to elevate a substance’s temperature without triggering a change in state. In contrast, water’s latent heat, which is the energy needed for boiling or evaporation, is approximately sevenfold greater than its sensible heat. “Utilizing water’s latent heat enables two-phase cooling, presenting a substantial enhancement in heat dissipation efficiency,” states Hongyuan Shi, the study’s lead author.
Prior investigations have underscored the viability of two-phase cooling; however, complications have arisen, particularly concerning the control of vapor bubble flow post-heating. Achieving optimal heat transfer efficacy depends on various aspects, including the design of the microchannels, control of the two-phase flow, and flow resistance characteristics.
The study introduces an innovative water-cooling system featuring three-dimensional microfluidic channel structures, which employ a capillary design along with a manifold distribution layer. The team engineered and evaluated a variety of capillary shapes, analyzing their performance under diverse conditions.
Findings revealed that the configurations of both the microchannel, through which the coolant circulates, and the manifold channels responsible for coolant distribution, have significant impacts on the system’s thermal and hydraulic efficiency.
The coefficient of performance (COP), quantifying the ratio of useful cooling output to necessary energy input, reached an impressive peak of 105, marking a significant improvement over traditional cooling methods.
“Effective thermal management in high-power electronic devices is essential for the evolution of next-gen technologies, and our design could pave the way for achieving necessary cooling capabilities,” remarks Masahiro Nomura, a senior author of the research.
The intersection of high-performance electronics and cutting-edge cooling technology highlighted in this study may prove crucial for enhancing the functionality of upcoming devices while contributing towards carbon neutrality initiatives.
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