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DGIST, under the leadership of President Kunwoo Lee, has reported a significant advancement in electronic component manufacturing. A team led by Professor Kwon Hyuk-joon from the Department of Electrical Engineering and Computer Science, with Dr. Jang Bong-ho as the principal author, has created a method for producing high-performance, liquid process-based electronic parts at lower temperatures than ever before by utilizing the “heat of combustion” produced within the materials. This innovative technology is particularly advantageous as it eliminates the need for high temperatures, allowing for its application on heat-sensitive plastic substrates. As a result, it is anticipated that this technology will find extensive use in flexible electronic devices and wearable smart technologies.
With the rise of easily bendable or slim electronic devices in our everyday lives, products such as smartwatches, foldable screens, and wearable sensors have improved convenience and adaptability. These advancements hint at future applications across diverse industries, necessitating the development of flexible but durable electronic components.
To achieve the versatility required for flexible electronics, thin-film transistors must be produced with extreme precision and thinness. Typically, liquid-phase processes that involve applying coatings in a liquid state are favored for their cost-effectiveness in mass production. However, these processes have been constrained by the high temperatures required to achieve optimal thin films, which poses challenges for their use on flexible substrates like heat-sensitive plastics. In light of these challenges, researchers have prioritized the creation of new manufacturing techniques that facilitate lower processing temperatures without sacrificing performance.
In response to these challenges, Professor Kwon’s research team implemented a “combustion synthesis” technique. Similar to how a heat pack generates warmth internally, this method uses the heat produced within the material during the liquid processing phase to create high-quality oxide films without the need to elevate the external temperature. Through this technique, the team successfully produced a high-performance thin-film transistor on a plastic substrate, reaching temperatures as low as 250 degrees Celsius.
The resulting transistor exhibits superior characteristics, surpassing current products in flexibility and resilience. It demonstrates excellent electrical performance on thin, bendable plastic substrates and has withstood over 5,000 bending cycles during stability tests, indicating its potential in next-generation flexible and wearable electronics.
“Traditional liquid-phase materials are beneficial for their strong compatibility with printing technologies. Yet, they face challenges due to the high temperatures necessary for the creation of superior thin films, which limits their use on low thermal resistance substrates,” explained Professor Kwon. “Our findings significantly reduce the processing temperatures for high-performance liquid-phase materials, opening new avenues for application across various sectors.”
Dr. Jang Bong-ho, as the first author, and Professor Kwon, the corresponding author, shared their findings in a study published in the journal npj Flexible Electronics. This research received support from the Ministry of Science and ICT through its Future Convergence Technology Pioneer STEAM Research Program and the Nanomaterial Technology Development Program.
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