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xMEMS Labs, an innovator in monolithic MEMS-based chips, has revealed plans to extend its cutting-edge µCooling fan-on-a-chip technology to AI data centers.
These micro fans are crafted entirely from silicon, utilizing the company’s advanced Micro Electromechanical Systems (MEMS) technology, where intricate mechanical structures are developed from silicon on semiconductor chips.
xMEMS has stated its intention to introduce what will be the first active thermal management solution embedded within high-performance optical transceivers.
Originally designed for compact mobile devices, the µCooling technology now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments found in 400G, 800G, and 1.6T optical transceivers. This sector is crucial yet remains underserved in the context of next-generation AI infrastructure.
In contrast to traditional cooling methods that typically focus on high-power (kilowatt) processors and GPUs, µCooling addresses the needs of smaller components that very large-scale cooling systems often overlook. This includes optical transceiver Digital Signal Processors (DSPs) with thermal dissipation power (TDP) ratings of 18W or higher. These components pose significant thermal challenges, increasingly limiting the performance and reliability of transceivers as data rates continue to rise.
The monolithic MEMS fan developed by xMEMS, manufactured using standard silicon processes, generates a steady stream of silent, vibration-free high-velocity air pulses. It stands out as the only active cooling solution compact enough to be integrated within the transceiver module. Thermal models predict that µCooling has the capability to dissipate up to 5W of localized heat, effectively lowering DSP operating temperatures by over 15% and reducing thermal resistance by more than 20%. This enhancement enables increased sustained throughput, improved signal integrity, and extended module lifespans.
A significant feature of the µCooling system design is its construction of a dedicated, isolated airflow channel, thermally coupled to internal heat sources within the transceiver but separated physically from the optical pathway and core electronic components. This architecture safeguards the optical elements from dust and contamination, ensuring high signal clarity and reliability while delivering substantial cooling performance.
“As data center interconnect demands rapidly grow alongside AI workloads, thermal bottlenecks are starting to surface at the component level — particularly within optical modules that are sealed, power-dense, and constrained by physical space,” remarked Mike Housholder, vice president of marketing at xMEMS Labs. “µCooling is uniquely suited to tackle this challenge by offering genuine in-module active cooling without compromising optical integrity or form factor.”
Market analysts anticipate robust growth in high-speed optical connectivity, with the Dell’Oro Group projecting that shipments of 800G and 1.6T transceivers will increase by over 35% CAGR through 2028. As these modules evolve in terms of performance and power, overcoming cooling obstacles will be essential for broader adoption.
The solid-state, piezoMEMS design of µCooling negates the need for motors, moving bearings, and issues related to mechanical wear, resulting in a maintenance-free and highly manufacturable solution. Its compact size, measuring as small as 9.3 x 7.6 x 1.13mm, and its scalable design make it suitable for modular applications across various interconnect formats, including QSFP-DD, OSFP, and future pluggable and co-packaged optics.
With the µCooling platform now catering to both mobile and data center sectors, xMEMS is fulfilling its mission of providing scalable, solid-state thermal innovations that can catalyze the next wave of high-performance electronic applications.
Founded in January 2018, xMEMS Labs has developed a piezoMEMS platform, launching the world’s first solid-state, monolithic MEMS speakers that blend the scalability of semiconductor manufacturing with exceptional audio quality. This technology facilitates new auditory experiences across a variety of applications, including wireless earbuds, wearables, hearing health, and even AI glasses. The xMEMS piezoMEMS platform has also been adapted to create the first μCooling fan on a chip, offering active thermal management solutions for smartphones and other ultra-thin, high-performance devices.
xMEMS proudly holds over 230 patents globally for their innovative technologies. The groundwork for this advanced technology has been laid over several years, as highlighted in early discussions surrounding their chip-based speaker innovations back in 2020. Now, the company is actively shipping its products to the market, and the announcement of their fan-on-a-chip micro cooling solutions marks yet another significant milestone in their journey.
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venturebeat.com